Glass sealed gas discharge tubes

ABSTRACT

Glass sealed gas discharge tubes. In some embodiments, a gas discharge tube (GDT) can include an insulator substrate having first and second sides and defining an opening. The GDT can further include a first electrode implemented to cover the opening on the first side of the insulator substrate, and a second electrode implemented to cover the opening on the second side of the insulator substrate. The GDT can further include a first glass seal implemented between the first electrode and the first side of the insulator substrate, and a second glass seal implemented between the second electrode and the second side of the insulator substrate, such that the first and second glass seals provide a hermetic seal for a chamber defined by the opening and the first and second electrodes.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Application No.62/512,163 filed May 29, 2017, entitled GLASS SEALED GAS DISCHARGETUBES, the disclosure of which is hereby expressly incorporated byreference herein in its respective entirety.

BACKGROUND Field

The present disclosure relates to gas discharge tubes and relateddevices and methods.

Description of the Related Art

A gas discharge tube (GDT) is a device having a volume of gas confinedbetween two electrodes. When sufficient potential difference existsbetween the two electrodes, the gas can ionize to provide a conductivemedium to thereby yield a current in the form of an arc.

Based on such an operating principle, GDTs can be configured to providereliable and effective protection for various applications duringelectrical disturbances. In some applications, GDTs can be preferableover semiconductor discharge devices due to properties such as lowcapacitance and low insertion/return losses. Accordingly, GDTs arefrequently used in telecommunications and other applications whereprotection against electrical disturbances such as overvoltages isdesired.

SUMMARY

In some implementations, the present disclosure relates to a gasdischarge tube (GDT) device that includes an insulator substrate havingfirst and second sides and defining an opening, and a first electrodeimplemented to cover the opening on the first side of the insulatorsubstrate, and a second electrode implemented to cover the opening onthe second side of the insulator substrate. The GDT device furtherincludes a first glass seal implemented between the first electrode andthe first side of the insulator substrate, and a second glass sealimplemented between the second electrode and the second side of theinsulator substrate, such that the first and second glass seals providea hermetic seal for a chamber defined by the opening and the first andsecond electrodes.

In some embodiments, the insulator substrate can include a ceramicsubstrate. In some embodiments, each of the first and second electrodecan include a copper material.

In some embodiments, each of the first and second glass seals caninclude a reflowed glass layer. The reflowed glass layer can includeglass material from a glass layer that was on the respective side of theinsulator substrate and the corresponding electrode.

In some embodiments, the GDT device can further include a gas or a gasmixture substantially contained within the chamber. In some embodiments,each of the first and second glass seal can include or be based on asilica compound. The silica compound can include, for example, silicondioxide or quartz.

In some implementations, the present disclosure relates to a method forfabricating a gas discharge tube (GDT) device. The method includesproviding or forming an insulator substrate having first and secondsides and defining an opening, and applying a glass layer around theopening on each of the first and second sides of the insulatorsubstrate. The method further includes providing or forming a firstelectrode and a second electrode, and applying a glass layer on each ofthe first and second electrodes. The method further includes forming anassembly of the first electrode on the first side of the insulatorsubstrate and the second electrode on the second side of the insulatorsubstrate, such that the glass layer on each electrode engages the glasslayer on the corresponding side of the insulator substrate. The methodfurther includes heating the assembly to melt the glass layer on eachelectrode and the glass layer on the corresponding side of the insulatorsubstrate and yield a reflowed glass seal.

In some embodiments, the applying of the glass layer around the openingon each side of the insulator substrate, and the applying of the glasslayer on each of the first and second electrodes can include a sinteringstep.

In some embodiments, the reflowed glass seal can provide a hermetic sealfor a chamber defined by the opening and the first and secondelectrodes. In some embodiments, the method can further includeproviding a desired gas during at least a portion of the heating suchthat the hermetically sealed chamber contains the desired gas.

In some embodiments, the method can further include cooling the assemblyafter the formation of the reflowed glass seal. In some embodiments, theGDT can be one of a plurality of GDTs joined by an insulator sheet thatdefines an array of insulator substrates. In some embodiments, themethod can further include singulating the insulator sheet yield aplurality of individual GDTs. Such singulating can be performed afterthe cooling of the assembly.

In some implementations, the present disclosure relates to an assemblyof gas discharge tubes (GDTs). The assembly can include an insulatorsheet having a plurality of units defined by respective boundaries, witheach unit including an insulator substrate having first and second sidesand defining an opening. The assembly can further include a plurality offirst electrodes, with each implemented to cover the opening of therespective unit on the first side of the insulator substrate, and aplurality of second electrodes, with each implemented to cover theopening of the respective unit on the second side of the insulatorsubstrate. The assembly can further include a plurality of first glassseals, with each implemented between the first electrode and the firstside of the insulator substrate of the respective unit, and a pluralityof second glass seal, with each implemented between the second electrodeand the second side of the insulator substrate of the respective unit,such that the first and second glass seals provide a hermetic seal for achamber defined by the opening and the first and second electrodes ofthe respective unit.

In some embodiments, the plurality of units can be arranged in an array.At least some of the boundaries can be configured to allow singulationof the array of units into separate singulated units.

In some implementations, the present disclosure relates to a method forfabricating gas discharge tube (GDT) devices. The method includesproviding or forming an insulator sheet having a plurality of unitsdefined by respective boundaries, with each unit including an insulatorsubstrate having first and second sides and defining an opening. Themethod further includes applying a glass layer around the opening on thefirst side of the insulator substrate of each unit, and applying a glasslayer around the opening on the second side of the insulator substrateof each unit. The method further includes providing or forming aplurality of first electrodes and a plurality of second electrodes, andapplying a glass layer on each of the first electrodes and each of thesecond electrodes. The method further includes assembling the firstelectrodes on the first side of the insulator sheet and the secondelectrodes on the second side of the insulator sheet, such that theglass layer on each electrode engages the glass layer on thecorresponding side of the insulator substrate of the respective unit.

In some embodiments, the method can further include heating the assemblyto melt the glass layer on each electrode and the glass layer on thecorresponding side of the insulator substrate of the respective unit andyield a reflowed glass seal that provides a hermetic seal for a chamberdefined by the opening and the first and second electrodes of therespective unit. The method can further include providing a desired gasduring at least a portion of the heating such that each hermeticallysealed chamber contains the desired gas. The method can further includecooling the assembly after the formation of the reflowed glass seal foreach unit. The method can further include singulating the insulatorsheet yield a plurality of individual GDTs.

In some implementations, the present disclosure relates to an electricaldevice having a gas discharge tube (GDT) that includes an insulatorsubstrate having first and second sides and defining an opening, and afirst electrode implemented to cover the opening on the first side ofthe insulator substrate, and a second electrode implemented to cover theopening on the second side of the insulator substrate. The GDT furtherincludes a first glass seal implemented between the first electrode andthe first side of the insulator substrate, and a second glass sealimplemented between the second electrode and the second side of theinsulator substrate, such that the first and second glass seals providea hermetic seal for a chamber defined by the opening and the first andsecond electrodes. The electrical device further includes an electricalcomponent electrically connected to the GDT.

In some embodiments, the electrical connection between the GDT and theelectrical component can be configured such that the electrical deviceis a single packaged unit.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a ceramic substrate having an opening that will become asealed chamber.

FIG. 1B shows a glass layer being applied to each of the first andsecond sides of the ceramic substrate.

FIG. 2A shows a first electrode that will cover the opening on the firstside of the ceramic substrate.

FIG. 2B shows a glass layer being applied to a side of the oxidizedfirst electrode.

FIG. 3A shows a second electrode that will cover the opening on thesecond side of the ceramic substrate.

FIG. 3B shows a glass layer being applied to a side of the oxidizedsecond electrode.

FIG. 4A shows an unassembled view of the assembly of FIG. 1B positionedto allow mating of the first electrode assembly of FIG. 2B on the firstside, and to allow mating of the second electrode assembly of FIG. 3B onthe second side.

FIG. 4B shows an assembled view of the arrangement of the threeassemblies of FIG. 4A.

FIG. 4C shows a further processed stage in which a reflowed hermeticglass seal is formed on each of the first and second sides of theceramic substrate.

FIG. 5A shows an example of a glass sealed gas discharge tube, in whicha sealed chamber as described herein can have a circular sectional shapeto provide a cylindrical shaped sealed chamber, and such a sealedchamber can be covered by circular shaped electrodes and sealed withcircular ring shaped glass seals.

FIG. 5B shows another example of a glass sealed gas discharge tube, inwhich a sealed chamber as described herein can have a circular sectionalshape to provide a cylindrical shaped sealed chamber, and such a sealedchamber can be covered by circular shaped electrodes and sealed withcircular ring shaped glass seals.

FIG. 5C shows that in some embodiments, a glass sealed gas dischargetube can include a sealed chamber having a rectangular sectional shapeto provide a box shaped sealed chamber, and such a sealed chamber can becovered by rectangular shaped electrodes and sealed with rectangularring shaped glass seals.

FIG. 5D shows that in some embodiments, a glass sealed gas dischargetube can include a sealed chamber having a circular sectional shape toprovide a cylindrical shaped sealed chamber, and such a sealed chambercan be covered by rectangular shaped electrodes and sealed with circularring shaped glass seals.

FIG. 6 shows an array of joined glass sealed gas discharge tubes formedon an insulator sheet such as a ceramic sheet.

FIG. 7 shows another example in which an array of joined glass sealedgas discharge tubes can be formed on an insulator sheet such as aceramic sheet.

FIGS. 8A, 8B and 8C show an example of how a ceramic sheet can beprocessed to produce an array of joined units, with each unit beingsimilar to the example of FIGS. 1A and 1B.

FIGS. 9A, 9B, 9C and 9D show an example of how electrodes can beprovided to first and second sides of the sheet assembly resulting fromFIGS. 8A, 8B and 8C.

FIGS. 10A, 10B, 100, 10D and 10E show an example of how an array ofelectrodes can be kept together while undergoing a number of processsteps involving the sheet assembly resulting from FIGS. 8A, 8B and 8C.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Described herein are examples related to gas discharge tubes (GDTs)having glass seals. In some embodiments, a GDT can include an insulatorlayer such as a ceramic substrate, and such an insulator layer candefine an opening that will become a sealed chamber. Such an opening canbe covered with an electrode on each of the two sides of the insulatorlayer. A glass seal can be formed between each electrode and thecorresponding surface of the insulator layer, at or near the perimeterof the opening, so as to form the sealed chamber. Various examples ofhow such a glass sealed GDT can be formed are described herein ingreater detail.

FIGS. 1-4 show an example process for manufacturing a glass sealed GDT.FIG. 1A shows a ceramic substrate 102 having an opening 101 that willbecome a sealed chamber. For the purpose of description, the ceramicsubstrate 102 can include a first side and a second side, and each ofthe two sides is shown to include a surface about the opening 101. Forexample, the first side can be the lower side, and the second side canbe the upper side, of the ceramic substrate 102 as shown in FIG. 1A.Although various examples are described herein in the context of aninsulator layer being a ceramic substrate, it will be understood thatone or more features of the present disclosure can also be implementedutilizing other types of electrically insulating substrates.

FIG. 1B shows a glass layer being applied to each of the first andsecond sides of the ceramic substrate 102. More particularly, a glasslayer 120 a is shown to be applied to the first side of the ceramicsubstrate 102, and a glass layer 122 a is shown to be applied to thesecond side of the ceramic substrate 102. In some embodiments, suchapplication of the glass layers 120 a, 122 a can be achieved in sequence(e.g., apply the glass layer 120 a to the upward facing first surface ofthe ceramic substrate 102, invert the ceramic substrate 102 so that thesecond surface faces upward, and apply the glass layer 122 a to thesecond surface), generally at the same time, or some combinationthereof. In some embodiments, the first and second sides of the ceramicsubstrate 102 can be substantially the same, and the corresponding glasslayers can also be substantially the same.

In some embodiments, the glass layers 120 a, 122 a can be formed aroundthe opening 101 of the ceramic substrate 102, be pre-formed in a shapeof a perimeter of the opening 101 of the ceramic substrate 102, etc.Once positioned on the respective surfaces of the ceramic substrate 102,the glass layers 120 a, 122 a can be sintered in, for example, a furnacewith appropriate temperature and atmospheric profile for an appropriatetime. In the example of FIG. 1B, an assembly of the ceramic substrate102 with the glass layers 120 a, 122 a sintered on the first and secondsides is indicated as 130.

FIG. 2A shows a first electrode 114 that will cover the opening 101 onthe first side of the ceramic substrate 102 of FIG. 1B. For the purposeof description, the first electrode 114 can include a first side and asecond side, and be dimensioned to cover the opening 101 on thecorresponding side of the ceramic substrate 102. Also for the purpose ofdescription, the first side of the first electrode 114 can be the sidethat faces inward into the opening 101, and the second side of the firstelectrode 114 can be the side that faces outward away from the opening101. In some embodiments, such an electrode can be, for example, acopper electrode, and such a copper electrode can be oxidized.

FIG. 2B shows a glass layer 120 b being applied to the first side of theoxidized first electrode 114. In some embodiments, the glass layer 120 bcan be formed around a perimeter of the first side of the firstelectrode 114, be pre-formed in a shape of the perimeter of the firstelectrode 114, etc. Once positioned on the first side of the firstelectrode 114, the glass layer 120 b can be sintered in, for example, afurnace with appropriate temperature and atmospheric profile for anappropriate time. In the example of FIG. 2B, an assembly of the firstelectrode 114 with the glass layer 120 b sintered on the first side isindicated as 140.

In some embodiments, an emissive coating can be applied on the firstside of the first electrode 114. In some embodiments, such an emissivecoating can be positioned at or near the center portion of the firstelectrode 114.

FIGS. 3A and 3B show a glass layer 122 b applied to a first side of asecond electrode 116 so as to yield an assembly 150, similar to theexample described above in reference to FIGS. 2A and 2B. In someembodiments, the assembly 150 of FIG. 3B can be generally the same asthe assembly 140 of FIG. 2B. However, it will be understood that suchelectrode assemblies can be different.

FIGS. 4A-4C show an example of how the assemblies 130, 140, 150 of FIGS.1B, 2B, 3B, respectively, can be assembled to produce a GDT having oneor more features as described herein. In FIG. 4A, the assembly 130having the ceramic substrate 102 with the glass layers (120 a, 122 a) ofFIG. 1B is shown to be positioned to allow mating of the first electrodeassembly 140 (with the glass layer 120 b on the first electrode 114) ofFIG. 2B on the first side of the ceramic substrate 102, and to allowmating of the second electrode assembly 150 (with the glass layer 122 bon the second electrode 116) of FIG. 3B on the second side of theceramic substrate 102.

FIG. 4B shows an assembled view of the foregoing arrangement of theassemblies 130, 140, 150 of FIG. 4A. More particularly, on the firstside of the ceramic substrate 102, the glass layer 120 a associated withthe ceramic substrate 102 is shown to mate with the glass layer 120 bassociated with the first electrode 114. Similarly, on the second sideof the ceramic substrate 102, the glass layer 122 a associated with theceramic substrate 102 is shown to mate with the glass layer 122 bassociated with the second electrode 116. In FIG. 4B, such an assembledarrangement is shown to form an enclosed volume 103 defined by theopening of the ceramic substrate 102, and the first and secondelectrodes 114, 116.

In some embodiments, the assembly of FIG. 4B can be placed in a furnaceand be provided with appropriate temperature and atmospheric conditionto cure the emissive coating (if present) on one or both of theelectrodes 114, 116. After such a curing process, air and outgases fromthe emissive coating curing process can be evacuated, and the furnacecan be flooded with a desired gas or gas mixture (e.g., argon, neon, orother gas mixture), and an appropriate temperature can be provided so asto melt the glass layers (120 a, 120 b, 122 a, 122 b in FIG. 4B) andallow such glass layers to reflow together to form a hermetic glass sealon each of the first and second sides of the ceramic substrate 102.

In FIG. 4C, such a reflowed hermetic glass seal is indicated as 120 onthe first side of the ceramic substrate 102, and as 122 on the secondside of the ceramic substrate 102. In some embodiments, an assemblyhaving such reflowed hermetic glass seals can be cooled in the furnaceaccording to an appropriate cooling profile to yield a glass sealed GDT100. In such a hermetically sealed configuration, a sealed chamber 160of the glass sealed GDT 100 includes the gas or gas mixture providedprior to the glass reflowing process.

In some embodiments, a glass sealed GDT having one or more features asdescribed herein can be configured to have different chamber shapesand/or different outer shapes. For example, FIGS. 5A-5D shownon-limiting examples of a glass sealed GDT 100 having one or morefeatures as described herein. In each example depicted in an upper planview, an electrode 116 is shown to be attached to the upper side of theceramic substrate 102 with a glass seal 122. It will be understood thata lower electrode (114 in FIG. 4C) is attached to the lower side of theceramic substrate 102 (with a glass seal 120) in a similar manner, so asto form the sealed chamber 160.

FIG. 5A shows that in some embodiments, a sealed chamber 160 of a glasssealed GDT 100 can have a circular sectional shape to provide acylindrical shaped sealed chamber 160, and such a sealed chamber can becovered by circular shaped electrodes (e.g., 116) and sealed withcircular ring shaped glass seals (e.g., 122). In the example of FIG. 5A,the outer shape of the ceramic substrate 102 can also have a circularshape, such that the glass sealed GDT 100 has a generally cylindricalshape.

FIG. 5B shows that in some embodiments, a sealed chamber 160 of a glasssealed GDT 100 can have a circular sectional shape to provide acylindrical shaped sealed chamber 160, and such a sealed chamber can becovered by circular shaped electrodes (e.g., 116) and sealed withcircular ring shaped glass seals (e.g., 122). In the example of FIG. 5B,the outer shape of the ceramic substrate 102 can have a rectangularshape (e.g., a square shape), such that the glass sealed GDT 100generally has a box shape.

FIG. 5C shows that in some embodiments, a sealed chamber 160 of a glasssealed GDT 100 can have a rectangular sectional shape (e.g., a squareshape) to provide a box shaped sealed chamber 160, and such a sealedchamber can be covered by rectangular shaped electrodes (e.g., 116) andsealed with rectangular ring shaped glass seals (e.g., 122). In theexample of FIG. 5C, the outer shape of the ceramic substrate 102 canhave a rectangular shape (e.g., a square shape), such that the glasssealed GDT 100 generally has a box shape.

FIG. 5D shows that in some embodiments, a sealed chamber 160 of a glasssealed GDT 100 can have a circular sectional shape to provide acylindrical shaped sealed chamber 160, and such a sealed chamber can becovered by rectangular shaped electrodes (e.g., 116) and sealed withcircular ring shaped glass seals (e.g., 122). In the example of FIG. 5D,the outer shape of the ceramic substrate 102 can have a rectangularshape (e.g., a square shape), such that the glass sealed GDT 100generally has a box shape.

It will be understood that the shape of the sealed chamber, the shape ofthe electrodes, the shape of the glass seals, and/or the shape of theceramic substrate can have other configurations that are different fromthe non-limiting examples of FIGS. 5A-5D.

In some embodiments, a plurality of glass sealed GDTs having one or morefeatures as described herein can be produced together in an arrayformat. For example, FIG. 6 shows an array 200 of joined glass sealedGDTs 100 formed on an insulator sheet 201 such as a ceramic sheet. Sucha ceramic sheet can define boundaries 203, 205 that allow the joinedglass sealed GDTs 100 to be singulated to yield a plurality ofindividual glass sealed GDTs. Each individual glass sealed GDT 100 isshown to include a ceramic substrate 102 and a sealed chamber 160covered by electrodes (e.g., 116) and sealed by glass seals (e.g., 122).

In the example of FIG. 6, each glass sealed GDT 100 is depicted as beingsimilar to the example of FIG. 5B. However, it will be understood thateach glass sealed GDT 100 in the array 200 of FIG. 6 can have othershapes. An example of a fabrication process utilizing the array formatof FIG. 6 is described in greater detail in reference to FIGS. 8 and 9.

FIG. 7 shows another example in which an array 200 of joined glasssealed GDTs 100 can be formed on an insulator sheet 201 such as aceramic sheet. Such a ceramic sheet can define boundaries 203, 205 thatallow the joined glass sealed GDTs 100 to be singulated to yield aplurality of individual glass sealed GDTs. Each individual glass sealedGDT 100 is shown to include a ceramic substrate 102 and a sealed chamber160 covered by electrodes (e.g., 116) and sealed by glass seals (e.g.,122). In the example of FIG. 7, the electrodes 116 are depicted as beinginterconnected in an array by interconnecting tabs 202, so as to allowthe array of electrodes 116 to be processed together.

In the example of FIG. 7, each glass sealed GDT 100 is depicted as beingsimilar to the example of FIG. 5B. However, it will be understood thateach glass sealed GDT 100 in the array 200 of FIG. 7 can have othershapes. An example of a fabrication process utilizing the array formatof FIG. 7 is described in greater detail in reference to FIGS. 8 and 10.

FIGS. 8A-8C show an example of how a ceramic sheet 212 can be processedto produce an array of joined units 210, with each unit being similar tothe example of FIGS. 1A and 1B.

In FIG. 8A, a ceramic sheet 212 is shown to be provided. Such a sheetcan include boundaries 214 that may or may not be marked, scored, etc.,and such boundaries can define an array of joined units 210. Asdescribed herein, each of such joined units can become a separateindividual unit upon singulation.

In FIG. 8B, an opening 216 is shown to be formed for each unit 210 ofthe ceramic sheet 212. In some embodiments, such openings can be formedutilizing, for example, drilling, punching, etching, and/or lasertechniques. It will be understood that in some embodiments, a ceramicsheet can be initially formed with the openings; and in such anembodiment, the foregoing opening-forming step can be omitted.

In FIG. 8C, a glass layer 120 a is shown to be provided on the firstside of each unit 210 of the ceramic sheet 212, and a glass layer 122 ais shown to be provided on the second side of each unit 210 of theceramic sheet 212, to yield an assembly 230. In some embodiments, suchglass layers can be formed individually for each unit 210, formedtogether for a plurality of units 210, or any combination thereof. Insome embodiments, an array of glass layers can be interconnected, andsuch an array of glass layers can be applied on the corresponding sideof the ceramic sheet 212 for the corresponding units 210. In someembodiments, the assembly 230 of the ceramic sheet 212 and the glasslayers 120 a, 122 a on the first and second sides can be sinteredsimilar to the example of FIG. 1B.

FIGS. 9A-9D show an example of how electrodes can be provided to firstand second sides of the assembly 230 of FIG. 8C. In FIG. 9A, an assembly232 is shown to include an electrode 114 and a glass layer 120 b, andsuch a glass layer is assumed to be provided on one side of theelectrode 114, similar to the example of FIG. 2B. In the example of FIG.9A, each of the assemblies 232 is shown to be positioned over thecorresponding opening on the first side of the assembly 230, such thatthe glass layer 120 b of the electrode 114 engages the glass layer 120 aof the unit 210 of the assembly 230. In FIG. 9A, such an engagement ofthe glass layers (120 a, 120 b) is depicted as 234.

In FIG. 9B, an assembly 242 is shown to include an electrode 116 and aglass layer 122 b, and such a glass layer is assumed to be provided onone side of the electrode 116, similar to the example of FIG. 3B. In theexample of FIG. 9B, each of the assemblies 242 is shown to be positionedover the corresponding opening on the second side of the assembly 230,such that the glass layer 122 b of the electrode 116 engages the glasslayer 122 a of the unit 210 of the assembly 230. In FIG. 9B, such anengagement of the glass layers (122 a, 122 b) is depicted as 244.

FIG. 9C shows an assembly 250 resulting from providing of the electrodesin FIGS. 9A and 9B. In some embodiments, such an assembly can beprocessed to reflow the glass layer assemblies 234, 244 and formcorresponding hermetic glass seals, similar to the examples describedherein in reference to FIGS. 4B and 4C. In some embodiments, such areflow process can be performed before or after singulation of theassembly 250 into individual units.

In the example of FIG. 9C, the assembly 250 is depicted as beingoriented so that the electrodes 114 and the corresponding glass layerassemblies 234 are again on the upper side of the assembly 230. It willbe understood that such flipping of the assembly 250 may or may not beincluded. For example, if the electrodes 114 and 116 and correspondingglass layer assemblies (234, 244) are generally the same, or iforientation of the assembly 250 does not impact further processing ofthe assembly 250, the assembly 250 can remain in the orientationresulting from the stage of FIG. 9B.

FIG. 9D shows a plurality of glass sealed GDTs 100, with each beingsimilar to the example of FIG. 4C. Such glass sealed GDTs can resultfrom the foregoing singulation of the assembly 250, before or after thereflow process resulting in the hermetic glass seals 120, 122.

In the examples described in reference to FIGS. 9A-9D, theelectrode/glass layer assemblies 232, 242 can be fabricated in a numberof ways. For example, each electrode/glass layer assembly (232 or 242)can be fabricated individually. In another example, an array ofinterconnected electrodes can be processed to provide a glass layer foreach electrode, and upon completion of such providing of the glasslayers, the electrode/glass layer assemblies can be separated intoindividual units for placement onto the ceramic sheet/glass layerassembly. In such a configuration, the glass layers can be provided tothe interconnected electrodes by being interconnected themselves,individually, or some combination thereof.

FIGS. 10A-10E show an example of how an array of electrodes can be kepttogether while undergoing a number of process steps. For example, FIG.10A shows that in some embodiments, an array 260 of electrodes (114 or116) can be interconnected with interconnecting features 202. Such anarray of electrodes can be arranged to correspond with respective units(210) of a ceramic sheet assembly (e.g., 230 in FIG. 8C).

FIG. 10B shows that such an array of interconnected electrodes can beprovided with glass layers. More particularly, a glass layer 262 can beprovided to one side of each electrode to yield an assembly 264. It willbe understood that such an assembly can be for an array of firstelectrodes (e.g., 114 in FIG. 2B) or an array of second electrodes(e.g., 116 in FIG. 3B). Further, and as described herein in reference toFIGS. 9A-9D, the glass layers 262 can be provided to the array ofinterconnected electrodes individually, in an interconnected array, orsome combination thereof.

In FIG. 10C, the assembly 264 of FIG. 10B is shown to be positioned overthe first side of the assembly 230 (e.g., of FIG. 8C), such that theglass layers 262 of the assembly 264 engage the corresponding glasslayers (e.g., 120 a in FIG. 8C) on the first side of the assembly 230.In FIG. 10C, such an engagement of the glass layers (262 of the assembly264 and 120 a of the assembly 230) is depicted as 234.

In FIG. 10D, another assembly similar to the assembly 264 of FIG. 10B isshown to be positioned over the second side of the assembly 230, suchthat the glass layers 262 of the other assembly engage the correspondingglass layers (e.g., 122 a in FIG. 8C) on the second side of the assembly230. In FIG. 10D, such an engagement of the glass layers (262 of theassembly 264 and 122 a of the assembly 230) is depicted as 244, and theresulting assembly is indicated as an assembly 270. In some embodiments,such an assembly (270) can be processed to reflow the glass layerassemblies 234, 244 and form corresponding hermetic glass seals, similarto the examples described herein in reference to FIGS. 4B and 4C. Insome embodiments, such a reflow process can be performed before or aftersingulation of the assembly 270 into individual units.

FIG. 10E shows a plurality of glass sealed GDTs 100, with each beingsimilar to the example of FIG. 4C. Such glass sealed GDTs can resultfrom the foregoing singulation of the assembly 270, before or after thereflow process. Upon the reflow process, the assemblies 234, 244 ofglass layers form respective hermetic glass seals 120, 122, so as toprovide a sealed chamber 160.

In the various examples described herein, an individual glass sealedGDT, whether fabricated individually, in an array, or some combinationthereof, is depicted as having a single sealed chamber (e.g., 160 in 4C,9D and 10E) with its own set of electrodes. It will be understood thatin some embodiments, one or more features of the present disclosure canalso be implemented in GDT devices having other configurations. Forexample, a GDT device can include a plurality of chambers, and suchchambers can be glass sealed with one or more sets of electrodes. Inanother example, an electrical device can include a GDT having one ormore features as described herein, and another component electricallycoupled to the GDT. Among others, details concerning variations in GDTdesigns and packaging applications that can utilize one or more featuresof the present disclosure can be found in PCT Publication Number WO2014/130838, which is hereby expressly incorporated by reference hereinin its entirety, and its disclosure is to be considered part of thespecification of the present application.

For the purpose of description, it will be understood that in someembodiments, a glass part such as a glass layer or a glass seal caninclude, for example, a material based on or including a compound silicasuch as silicon dioxide or quartz.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

1. A gas discharge tube (GDT) device comprising: an insulator substratehaving first and second sides and defining an opening; a first electrodeimplemented to cover the opening on the first side of the insulatorsubstrate, and a second electrode implemented to cover the opening onthe second side of the insulator substrate; and a first glass sealimplemented between the first electrode and the first side of theinsulator substrate, and a second glass seal implemented between thesecond electrode and the second side of the insulator substrate, suchthat the first and second glass seals provide a hermetic seal for achamber defined by the opening and the first and second electrodes. 2.The GDT device of claim 1, wherein the insulator substrate includes aceramic substrate.
 3. The GDT device of claim 1, wherein each of thefirst and second electrode includes a copper material.
 4. The GDT deviceof claim 1, wherein each of the first and second glass seals includes areflowed glass layer.
 5. The GDT device of claim 4, wherein the reflowedglass layer includes glass material from a glass layer that was on therespective side of the insulator substrate and the correspondingelectrode.
 6. The GDT device of claim 1, further comprising a gas or agas mixture substantially contained within the chamber.
 7. The GDTdevice of claim 1, wherein each of the first and second glass sealincludes or is based on a silica compound.
 8. The GDT device of claim 7,wherein the silica compound includes silicon dioxide or quartz.
 9. Amethod for fabricating a gas discharge tube (GDT) device, the methodcomprising: providing or forming an insulator substrate having first andsecond sides and defining an opening; applying a glass layer around theopening on each of the first and second sides of the insulatorsubstrate; providing or forming a first electrode and a secondelectrode; applying a glass layer on each of the first and secondelectrodes; forming an assembly of the first electrode on the first sideof the insulator substrate and the second electrode on the second sideof the insulator substrate, such that the glass layer on each electrodeengages the glass layer on the corresponding side of the insulatorsubstrate; and heating the assembly to melt the glass layer on eachelectrode and the glass layer on the corresponding side of the insulatorsubstrate and yield a reflowed glass seal.
 10. The method of claim 9,wherein the applying of the glass layer around the opening on each sideof the insulator substrate, and the applying of the glass layer on eachof the first and second electrodes includes a sintering step.
 11. Themethod of claim 9, wherein the reflowed glass seal provides a hermeticseal for a chamber defined by the opening and the first and secondelectrodes.
 12. The method of claim 11, further comprising providing adesired gas during at least a portion of the heating such that thehermetically sealed chamber contains the desired gas.
 13. The method ofclaim 9, further comprising cooling the assembly after the formation ofthe reflowed glass seal.
 14. The method of claim 13, wherein the GDT isone of a plurality of GDTs joined by an insulator sheet that defines anarray of insulator substrates.
 15. The method of claim 14, furthercomprising singulating the insulator sheet yield a plurality ofindividual GDTs.
 16. The method of claim 15, wherein the singulating ofthe insulator sheet is performed after the cooling of the assembly. 17.(canceled)
 18. (canceled)
 19. (canceled)
 20. A method for fabricatinggas discharge tube (GDT) devices, the method comprising: providing orforming an insulator sheet having a plurality of units defined byrespective boundaries, each unit including an insulator substrate havingfirst and second sides and defining an opening; applying a glass layeraround the opening on the first side of the insulator substrate of eachunit; applying a glass layer around the opening on the second side ofthe insulator substrate of each unit; providing or forming a pluralityof first electrodes and a plurality of second electrodes; applying aglass layer on each of the first electrodes and each of the secondelectrodes; and assembling the first electrodes on the first side of theinsulator sheet and the second electrodes on the second side of theinsulator sheet, such that the glass layer on each electrode engages theglass layer on the corresponding side of the insulator substrate of therespective unit.
 21. The method of claim 20, further comprising heatingthe assembly to melt the glass layer on each electrode and the glasslayer on the corresponding side of the insulator substrate of therespective unit and yield a reflowed glass seal that provides a hermeticseal for a chamber defined by the opening and the first and secondelectrodes of the respective unit.
 22. (canceled)
 23. The method ofclaim 21, further comprising cooling the assembly after the formation ofthe reflowed glass seal for each unit.
 24. The method of claim 23,further comprising singulating the insulator sheet yield a plurality ofindividual GDTs.
 25. (canceled)
 26. (canceled)